Pedro O. Quintero-Aguilo, Ph.D

Pedro O. Quintero-Aguilo, Ph.D

Assistant Professor

Office: L-209
pedro.quintero@upr.edu
T: 787-832-4040 x5971
http://www.me.uprm.edu/pquintero

Education

  • Ph.D.
University of Maryland-College Park, Maryland, USA, 2008
  • M.S.
Universidad de Puerto Rico, Mayaguez, PR, 1998
  • B.S.
Universidad de Puerto Rico, Mayaguez, PR, 1996

Background

  • 2008-present
Assistant Professor, Department of Mechanical Engineering, University of Puerto Rico at Mayaguez
  • 2005-2008
Graduate Research Assistant: Department of Mechanical Engineering CALCE Research Center at the University of Maryland-College Park, College Park, MD
  • 2000-2005
Member of the Technical Staff: Senior Solder Process Specialist, Hewlett-Packard, Aguadilla PR.
  • 2003-2004
Instructor, Department of General Engineering and Industrial Engineering at the University of Puerto Rico-Mayaguez, Mayaguez, PR
  • 1997-2000
Manufacturing Engineer, Intel Puerto Rico, Las Piedras, Puerto Rico

 

Academic and Professional Leadership

  • iMAPS member, 2006 until present
  • Member of Colegio de Ingenieros y Agrimensores de Puerto Rico, 17596 PE
  • Reviewer, IEEE Transactions on Components and Packaging Technologies, 2007-
  • Reviewer, Microelectronics Reliability, 2006-
  • Coordinator, Material and Manufacturing Sciences, 2009-

Conference Publications

  • Quintero, T. Oberc, F.P. McCluskey, “Lead-Free Die Attach Reliability for High Temperature Environments,” Proceedings of iMAPS 40th International Symposium on Microelectronics, San Jose, California, 2007.
  • Quintero, R. Jain, F.P. McCluskey, “Using Prognostics for Extending Maintenance-Free Operation Interval – A case study using Inductive Sensor for Condition Based Maintenance of a Wave Solder Machine,” Proceedings of iMAPS 40th International Symposium on Microelectronics, San Jose, California, 2007.
  • Quintero, B. Geil, F.P. McCluskey, “High Temperature Die Attach by Liquid Phase Sintering,” Proc of HiTEC, Albuquerque, NM, May, 2008.
  • Oberc, P. Quintero, F.P. McCluskey, “Viability of an Alternative High Temperature Surface Mount Component Attach,” Proc of HiTEC, Albuquerque, NM, May, 2008.
  • Quintero, T. Oberc, F.P. McCluskey, “Reliability Assessment of High Temperature Lead-Free Device Attach Technologies,” Proc of ECTC, Orlando, FL, May, 2008.
  • Quintero, R. Valentín, D. Ma, “Decision Matrix as a Valuable Tool for Pb-Free Alloy Selection,” Proceedings of iMAPS 42nd International Symposium on Microelectronics, San Jose, California, 2009
  • Quintero, F.P. McCluskey, B. Koene, “High Temperature Lead-Free Attach Reliability,” ASME Interpack Conf., Vancouver, BC, July 8-12, 2007. IPACK 2007-33457
  • P. Quintero, R. Valentín, P. Cáceres-Valencia, “Combinatorial Studies for the Minimization of Tin Whiskers Growth in Pb-Free Electronics,” ASME Interpack Conf., San Francisco, CA, July 19-23, 2009. IPACK 2009-89029.
  • M. Molina, A. Velasco, W. Otano and P. Quintero, “Pressureless Sintering Progression of a Silver Nanoparticle Attach Material Via Micrographic Analysis,” IMAPS International Conference on High Temperature Electronics (HiTEC 2012), May 8-10, 2012, Albuquerque, New Mexico, USA.
  • R. Rodriguez, D. Ibitayo and P. Quintero, “Microstructural Evolution and Thermal Characterization of a High Temperature Die Attach Lead-Free System,” IMAPS International Conference on High Temperature Electronics (HiTEC 2012), May 8-10, 2012, Albuquerque, New Mexico, USA.
  • L. Renta, P. Quintero, R. Valentin, D. Ma, and A. Hovland, “Study of the thermomechanical inelastic energy response of backward compatible solder joints made with SAC versus re-balled SnPb components,” Proceedings of ASME InterPACK 2011, July 6-8, 2011, Portland, Oregon, USA, InterPACK2011- 52036.
  • R. Rodriguez, D. Ibitayo, and P. Quintero, “High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion,” Proceedings of ASME InterPACK 2011, July 6-8, 2011, Portland, Oregon, USA, InterPACK2011-52049.
  • P. Quintero, “Die attach techniques for high temperature/harsh environment packaging: A shifting melting point approach,” Invited speaker at the 2012 Electronic Packaging Symposium, October 9-10, 2012, GE Global Research, Niskayuna, N.Y.
  • P. Quintero, “Physics of Failure, Failure Mechanisms and Damage Analysis,” University of Maryland at College Park as part of Graduate Course ENME 695Invited by Prof. Michael Pecht, Feb. 28, 2011.

 

Major Peer-Reviewed Journal Publications

  • P. Quintero, P. McCluskey, B. Koene, “Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications,” Microelectronics Reliability, Available online 26 September 2013, ISSN 0026-2714, http://dx.doi.org/10.1016/j.microrel.2013.08.002.
  • A. Diaz and P. Quintero, “Tin Nanoparticles Based Solder Paste for Low Temperature Processing,” Journal of Microelectronics and Electronic Packaging, JMEP Issue 4, 2013.
  • R. Rodriguez, D. Ibitayo, and P. Quintero, “Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding,” Journal of Electronic Materials, 2013, DOI: 10.1007/s11664-013-2614-z.
  • Rodriguez, R.I.; Ibitayo, D.; Quintero, P.O., “Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications,” Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.3, no.4, pp.549,557, April 2013 doi: 10.1109/TCPMT.2013.2243205
  • P. Quintero and F.P. McCluskey, “Temperature cycling reliability of high temperature lead-free die attach technologies,” IEEE Transactions on Device and Materials Reliability, (December 2011), Vol. 11, No. 4, pp. 531-539
  • Quintero and F.P. McCluskey, “Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment,” Journal of Microelectronics and Electronic Packaging, (2009) 6, 1-9.

Awards

  • US patent serial number: US60/891,763; “Ag-In Transient Liquid Phase High Temperature Solder Paste Attach”. Patent filed on January, 2008.
  • Best Professor of Mechanical Engineering voted by students, May 2008
  • UMD Office of Technology Commercialization 2006 Invention of the Year Finalist in Physical Science
  • Best student presenter award given at the CALCE consortium meeting, Fall 2007
  • Best student paper award at the International Conference on High Temperature Electronics (HiTEC 2008).
  • Best poster award at the UMD Mechanical Engineering Research Day (2008) Alfred P. Sloan Scholarship, 2006-2007
  • James Clark Scholarship, 2005-2007
  • Intel Corporation System Manufacturing Divisional Award Winner for work on “Passive Measurement System to avoid Wrong Parts in Electronic Assemblies, Oregon, 1998